Our machines are engineered for low pressure molding applications. Using specialty resins to encapsulate delicate parts.
Applications including : automotive electronics, PCBA,coil, fiber-optic, LED lighting, wire, cable, etc.
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Portable rugged design.
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Pressurized tank integrated into gun.
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Precise PID thermal control.
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Designed specifically for PA adhesives.
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Light weight aluminum material.
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Easy loading design.
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Compact storage.
Machine Size / Weight |
540 mm x 400 mm x 510 mm / 19 kg
21.26 in x 15.75 in x 20.08 in / 41.9 lbs |
Gun Weight |
2.5 kg | 5.5 lbs |
Working Station Height |
N/A |
Packing Size / Weight |
610 mm x 440 mm x 465 mm / 20 kg
24.02 in x 17.32 in x 18.31 in / 44.1 lbs |
Melting Tank |
0.3 liter |
Auto Feeding System |
N/A |
Gun |
36.4° x 1 |
Heated Hose |
N/A |
Electricity |
200-240VAC / 1 Phase/ 50Hz |
Temperature Control Zones |
1 |
Temperature Range |
Ambient up to 250°C / 485°F |
Max .Power |
0.5 Kw |
Min. Air Pressure |
0.5MPa | 73 Psi |
Air Consumption |
0.05 m3 / min | 1.77 ft³ / min |
Clamping |
N/A |
Clamping Force |
N/A |
Clamping Stroke |
N/A |
Control System |
Temp controller, Air pressure regulator, Time relay |
Safety Protection |
N/A |
Mold Set Size |
100 mm x 80 mm x 60 mm / 3.7 kg ( Steel ) ,1.2 kg ( Aluminum )
3.94 in x 3.15 in x 2.36 mm / 8.16 lbs (Steel),2.65 lbs (Aluminum) |
Max . Mold Set Size |
120 mm x 100 mm x 60 mm
9.05 in x 5.91 in x3.15 in |
※ LPMS reserved the right of final explanation. Please forgive that if any change of products will not specify additionally.